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Поиск Datasheets |
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1MD04-010-08 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
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1MD04-010-08 Datasheet
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Постоянная ссылка на эту страницу |
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1MD04-010-08 и другие |
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Компонент | Описание | Производитель | PDF |
0015477542 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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500T012E31H |
Qwik-Ty Strain Relief Backshell |
Glenair, Inc. |
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A-41815-0317 |
KK 156 HOUSING PCB 41815 SERIES |
Molex Electronics Ltd. |
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A-41815-0315 |
KK 156 HOUSING PCB 41815 SERIES |
Molex Electronics Ltd. |
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26-48-1085 |
3.96mm (.156") Pitch KK^ Header, Breakaway, Vertical, Square Pin, with Friction Lock,8 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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