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| 0015801161 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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0015801161 Datasheet
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Постоянная ссылка на эту страницу |
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0015801161 и другие |
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| Компонент | Описание | Производитель | PDF |
| 1ML06-017-05T |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
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| 1MDL06-050-05 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
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| 001591-0127 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 0015801521 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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| 0015800641 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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