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Поиск Datasheets |
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73642-1200 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, Press-Fit,Open End, 144 Circuits |
Molex Electronics Ltd. |
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73642-1200 Datasheet
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73642-1200 и другие |
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Компонент | Описание | Производитель | PDF |
1MDL06-068-03 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
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25AA160BT-I/MSG |
16K SPI Bus Serial EEPROM |
Microchip Technology |
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501527-0430 |
0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row,Vertical, 1.30mm (.051") Stacking Height |
Molex Electronics Ltd. |
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ARK-2150L-D7A1E |
Intel^ 3rd Generation Core i3-3217UE/i7-3517UE High Performance Fanless Embedded Box PC |
Advantech Co., Ltd. |
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AF816N5550S1-T |
CHIP ANTENNA |
Taiyo Yuden, Inc |
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Datasheet's на KAZUS.RU |
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