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Поиск Datasheets |
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| 73644-0218 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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73644-0218 Datasheet
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Постоянная ссылка на эту страницу |
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73644-0218 и другие |
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| Компонент | Описание | Производитель | PDF |
| 370AP023NF12 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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| 501568-0207 |
1.0 WIRE TO BOARD CONN. 1-ROW R/A WAFER ASSY 2-5CKT -LEAD FREE- |
Molex Electronics Ltd. |
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| 5015273230 |
0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical, 1.30mm |
Molex Electronics Ltd. |
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| 73644-0205 |
2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A |
Molex Electronics Ltd. |
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| ARK-4180Y-1S0A1E |
Expandable PCI-104 Performance Solution with -40 ~ 75` C Operating Temperature |
Advantech Co., Ltd. |
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