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Поиск Datasheets |
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| 73644-0206 |
2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B |
Molex Electronics Ltd. |
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73644-0206 Datasheet
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Постоянная ссылка на эту страницу |
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73644-0206 и другие |
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| Компонент | Описание | Производитель | PDF |
| 73644-1000 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits |
Molex Electronics Ltd. |
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| 0015910227-ND |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 1N1203A |
Medium Power Silicon Rectifier Diodes, 12 A |
Vishay Siliconix |
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| A-42226-0105 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 35 Circuits, 0.76lm (30l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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| ARK-3360F-N4A1E |
High Performance Mobile Intel^ ATOM N450/D510 Fanless Solution with Dual Display and Multiple I/O |
Advantech Co., Ltd. |
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