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Поиск Datasheets |
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370AP024M10 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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370AP024M10 Datasheet
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370AP024M10 и другие |
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Компонент | Описание | Производитель | PDF |
73644-1208 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position E, 144 Circuits |
Molex Electronics Ltd. |
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A-42226-0131 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 26 Circuits, Tin (Sn) Plating. with Kinked PC Tails |
Molex Electronics Ltd. |
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25AA320-I/ST |
32K SPI Bus Serial EEPROM |
Microchip Technology |
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A-42226-0124 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 19 Circuits, Tin (Sn) Plating. with Kinked PC Tails |
Molex Electronics Ltd. |
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370AP024C18 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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