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Поиск Datasheets |
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370AP024G08 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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370AP024G08 Datasheet
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370AP024G08 и другие |
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Компонент | Описание | Производитель | PDF |
25AA160DT-E/P |
16K SPI Bus Serial EEPROM |
Microchip Technology |
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1.5SMC56CA |
1500W Surface Mount Transient Voltage Suppressor |
TAITRON Components Incorporated |
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73644-1213 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position G, 144 Circuits |
Molex Electronics Ltd. |
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001591-5489 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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5015680509 |
1.0 WIRE TO BOARD CONN. 1-ROW R/A WAFER ASSY 2-5CKT -LEAD FREE- |
Molex Electronics Ltd. |
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Datasheet's на KAZUS.RU |
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