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Поиск Datasheets |
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| 73644-1216 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits |
Molex Electronics Ltd. |
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73644-1216 Datasheet
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Постоянная ссылка на эту страницу |
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73644-1216 и другие |
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| Компонент | Описание | Производитель | PDF |
| 001591-5529 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 370AP024NF10 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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| 1.5SMC51CA |
Transient Voltage Suppressors |
MERITEK ELECTRONICS CORPORATION |
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| 73644-1217 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits |
Molex Electronics Ltd. |
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| AFC20-12S |
AC-DC Power Module |
Arch Electronics Corp. |
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