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Поиск Datasheets |
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| 370AR023G08 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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370AR023G08 Datasheet
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Постоянная ссылка на эту страницу |
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370AR023G08 и другие |
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| Компонент | Описание | Производитель | PDF |
| 370AR023B16 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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| 501571-2051 |
1.0 WIRE TO BOARD CONN. 2-ROW R/A WAFER ASSY -LEAD FREE- |
Molex Electronics Ltd. |
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| 73644-2000 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits |
Molex Electronics Ltd. |
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| 0015910728 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 1.5SMC6.8A |
UNI-DIRECTIONAL GLASS PASSIVATED JUNCTION TRANSIENT VOLTAGE SUPPRESSOR 1500 WATTS, 6.8 THRU 200 VOLTS |
Central Semiconductor Corp |
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