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Поиск Datasheets |
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| 370AR023G10 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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370AR023G10 Datasheet
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Постоянная ссылка на эту страницу |
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370AR023G10 и другие |
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| Компонент | Описание | Производитель | PDF |
| 501571-3054 |
1.0 WIRE TO BOARD CONN. 2-ROW R/A WAFER ASSY -LEAD FREE- |
Molex Electronics Ltd. |
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| 73644-2001 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 72 Circuits |
Molex Electronics Ltd. |
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| AFC226M16C12T |
SMT Aluminum Electrolytic Capacitors - Low Impedance, 105 ЉC |
Cornell Dubilier Electronics |
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| 25AA160T-E/P |
16K SPI Bus Serial EEPROM |
Microchip Technology |
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| A-42226-0144 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38lm (15l) Gold (Au) Selective Plating, with Kinked PC Tails |
Molex Electronics Ltd. |
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