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Поиск Datasheets |
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73644-2018 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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73644-2018 Datasheet
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73644-2018 и другие |
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Компонент | Описание | Производитель | PDF |
370AR023G18 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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AFC20-3.3S |
AC-DC Power Module |
Arch Electronics Corp. |
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501461-0501 |
0.50mm (.020") Pitch FPC Connector, BackFlip, Right Angle, SMT, Bottom Contact Style |
Molex Electronics Ltd. |
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1N133 |
GOLD BONDED DIODES |
List of Unclassifed Manufacturers |
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1N128 |
GOLD BONDED DIODES |
List of Unclassifed Manufacturers |
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