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Поиск Datasheets |
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501571-3051 |
1.0 WIRE TO BOARD CONN. 2-ROW R/A WAFER ASSY -LEAD FREE- |
Molex Electronics Ltd. |
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501571-3051 Datasheet
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501571-3051 и другие |
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Компонент | Описание | Производитель | PDF |
73644-2205 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A, Polarizing Key Position C, 72 Circuits |
Molex Electronics Ltd. |
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0015910467 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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25AA320AT-E/SN |
32K SPI Bus Serial EEPROM |
Microchip Technology |
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ARL2504F |
HIGH VOLTAGE BUTTON DIODES FOR AUTOMOTIVE |
Shanghai Lunsure Electronic Tech |
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73644-2212 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 72 Circuits |
Molex Electronics Ltd. |
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