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Поиск Datasheets |
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370AR024NF18 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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370AR024NF18 Datasheet
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370AR024NF18 и другие |
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Компонент | Описание | Производитель | PDF |
73644-3216 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits |
Molex Electronics Ltd. |
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A-42226-0200 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 25 Circuits, 0.76lm (30l) Gold (Au) Selective Plating, with Kinked PC Tails |
Molex Electronics Ltd. |
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5015911011 |
0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical Stacking, 0.90mm |
Molex Electronics Ltd. |
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AFC5-12D12-F |
Dual output |
Artesyn Technologies |
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ARK-6620-18ZE |
Compact Mini-ITX Chassis for Embedded Applications |
Advantech Co., Ltd. |
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