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Поиск Datasheets |
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| 370AS017XB08 |
Composite Cable-Sealing Environmental Backshell |
Glenair, Inc. |
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370AS017XB08 Datasheet
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Постоянная ссылка на эту страницу |
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370AS017XB08 и другие |
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| Компонент | Описание | Производитель | PDF |
| 370AS017XO09 |
Composite Cable-Sealing Environmental Backshell |
Glenair, Inc. |
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| 370AS017XM08 |
Composite Cable-Sealing Environmental Backshell |
Glenair, Inc. |
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| 0015910647-ND |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 501645-3420 |
2.00mm (.079") Pitch iGrid Wire-to-Board Header, Dual Row, Vertical, with PCB Locator, 34 Circuits, Lead-free |
Molex Electronics Ltd. |
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| 25AA640AX-E/P |
64K SPI Bus Serial EEPROM |
Microchip Technology |
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