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Поиск Datasheets |
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| 370FP023C18 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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370FP023C18 Datasheet
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Постоянная ссылка на эту страницу |
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370FP023C18 и другие |
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| Компонент | Описание | Производитель | PDF |
| 73780-3113 |
2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512"), Pin Length 2.50mm (.098"), |
Molex Electronics Ltd. |
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| 0015911628-ND |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 26-7402-150 |
Up to 180 mW Fiber Bragg Grating Stabilized 980 nm Pump Modules |
JDS Uniphase Corporation |
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| 26-7402-140 |
Up to 180 mW Fiber Bragg Grating Stabilized 980 nm Pump Modules |
JDS Uniphase Corporation |
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| 1N2110 |
Rectifiers |
New Jersey Semi-Conductor Products, Inc. |
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