 |
Поиск Datasheets |
|
| 26-7552-170-TE |
Up to 180 mW Fiber Bragg Grating Stabilized 980 nm Pump Modules with Tight Tracking |
JDS Uniphase Corporation |
 |
|
26-7552-170-TE Datasheet
|
|
|
|
Постоянная ссылка на эту страницу |
|
|
26-7552-170-TE и другие |
|
| Компонент | Описание | Производитель | PDF |
| 370FP024B10 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
|
| 73780-3257 |
2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 17.00mm (.669"), Pin Length 3.50mm (.138"), |
Molex Electronics Ltd. |
|
| 73780-3244 |
2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 3.00mm (.118"), |
Molex Electronics Ltd. |
|
| 0015911704 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
|
| 0015911723 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 72 Circuits, 0.76lm (30l) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs |
Molex Electronics Ltd. |
|
|  |
|
Datasheet's на KAZUS.RU |
|
|
• 10.000.000 компонентов
• 300.000 поисковых запросов
• 500.000 закачек PDF в месяц
• 700.000 пользователей
|
|
Реклама на сайте |
|
|
|
|
|
|
