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Поиск Datasheets |
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| 73943-1200 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, Solder Tail Closed End, 144 Circuits |
Molex Electronics Ltd. |
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73943-1200 Datasheet
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Постоянная ссылка на эту страницу |
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73943-1200 и другие |
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| Компонент | Описание | Производитель | PDF |
| 370SR024B14 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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| 1N2994C |
10 WATT ZENER DIODES |
Microsemi Corporation |
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| 26PC05K0D6 |
Temp. compensated and calibrated pressure sensors |
Sensortechnics GmbH |
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| 0022272271 |
2.54mm (.100) Pitch KK^ Wire-to-Board Header, Vertical, with Friction Lock, 27 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| 73943-2000 |
2.54mm (.100") Pitch C-Grid^ Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 8.13mm (.320") Mating Pin Length, 0.38lm (15l") Gold (Au) Selective |
Molex Electronics Ltd. |
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