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Поиск Datasheets |
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| 377HW040XB19 |
Fiber-Optic Strain-Relief Backshell |
Glenair, Inc. |
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377HW040XB19 Datasheet
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Постоянная ссылка на эту страницу |
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377HW040XB19 и другие |
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| Компонент | Описание | Производитель | PDF |
| 74061-1001 |
2.00mm (.079") Pitch VHDM^ Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Pin End Version, 80 Circuits, Pin Length 4.25mm (.167") |
Molex Electronics Ltd. |
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| 100-271M |
Micro i Ribbon-Lead Inductors |
API Delevan |
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| 1N3029 |
1 WATT METAL CASE ZENER DIODES |
Microsemi Corporation |
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| 0022284030 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Vertical, 3 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240) |
Molex Electronics Ltd. |
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| A-70400-1018 |
2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 28, 0.38lm (15l") Gold (Au) |
Molex Electronics Ltd. |
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