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Поиск Datasheets |
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| A-70567-0012 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0012 Datasheet
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Постоянная ссылка на эту страницу |
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A-70567-0012 и другие |
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| Компонент | Описание | Производитель | PDF |
| A-70567-0017 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| 507-142E51-2BB |
EMI/RFI Dual Entry Banding Backshell |
Glenair, Inc. |
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| 1N3315 |
50W ZENER(DO5) |
Naina Semiconductor ltd. |
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| 507-142E31EB |
EMI/RFI Dual Entry Banding Backshell |
Glenair, Inc. |
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| A-70567-0026 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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