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A-70567-0076 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0076 Datasheet
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A-70567-0076 и другие |
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Компонент | Описание | Производитель | PDF |
380AA071M10 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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0025022030 |
2.54mm (.100") Pitch C-Grid^ Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 30 Circuits, Tn (Sn) Plating |
Molex Electronics Ltd. |
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AS28F128J3MRG-15/XT |
Plastic Encapsulated Microcircuit 128Mb, x8 and x16 Q-FLASH Memory Even Sectored, Single Bit per Cell Architecture |
Austin Semiconductor |
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380AA071M12 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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A-70567-0085 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38lm (15l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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