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| AS28F128J3M |
Plastic Encapsulated Microcircuit 128Mb, x8 and x16 Q-FLASH Memory Even Sectored, Single Bit per Cell Architecture |
Austin Semiconductor |
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AS28F128J3M Datasheet
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AS28F128J3M и другие |
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| Компонент | Описание | Производитель | PDF |
| AG-16080AGULB |
SPECIFICATIONS FOR LCD MODULE |
List of Unclassifed Manufacturers |
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| 380AA071M18 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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| A-70567-0090 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38lm (15l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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| A-70567-0063 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| A-70567-0095 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38lm (15l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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