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A-70567-0145 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76lm (30l) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
Molex Electronics Ltd. |
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A-70567-0145 Datasheet
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A-70567-0145 и другие |
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Компонент | Описание | Производитель | PDF |
0026192121 |
3.96mm (.156") Pitch KK^ Wire-to-Board Header, Vertical, Round Pin, with Polarizing Wall, 12 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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507-145-E51B |
Micro-D Backshells EMI Split Backshell, Round Cable Entry 507-145 |
Glenair, Inc. |
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1N3335B |
50W ZENER(DO5) |
Naina Semiconductor ltd. |
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380AA117B16 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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7427930 |
WE-PBF Flat Wire High Current SMD Ferrite Bead |
Wurth Elektronik GmbH & Co. KG, Germany. |
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