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Поиск Datasheets |
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| A-70567-0152 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits |
Molex Electronics Ltd. |
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A-70567-0152 Datasheet
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Постоянная ссылка на эту страницу |
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A-70567-0152 и другие |
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| Компонент | Описание | Производитель | PDF |
| A-70567-0196 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| A-70567-0158 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits |
Molex Electronics Ltd. |
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| 507-145-M21HB |
Micro-D Backshells EMI Split Backshell, Round Cable Entry 507-145 |
Glenair, Inc. |
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| AG-16080AYJB |
SPECIFICATIONS FOR LCD MODULE |
List of Unclassifed Manufacturers |
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| 380AB006M08 |
EMI/RFI Non-Environmental Backshell |
Glenair, Inc. |
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