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Поиск Datasheets |
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380AB019M12 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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380AB019M12 Datasheet
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380AB019M12 и другие |
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Компонент | Описание | Производитель | PDF |
A-70567-0287 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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507-145-Z225B |
Micro-D Backshells EMI Split Backshell, Round Cable Entry 507-145 |
Glenair, Inc. |
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7429FCT520DTPB |
MULTILEVEL PIPELINE REGISTERS |
Integrated Device Technology |
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AS29F200T-55SC |
5V 256K x 8/128K x 8 CMOS FLASH EEPROM |
Alliance Semiconductor Corporation |
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A-70567-0274 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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