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A-70567-0297 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0297 Datasheet
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A-70567-0297 и другие |
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Компонент | Описание | Производитель | PDF |
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GOLD BONDED DIODES(Low forward voltage, low power consumption) |
List of Unclassifed Manufacturers |
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0026602120 |
3.96mm (.156") Pitch KK^ Solid Header, Vertical, without Peg, 12 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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AG-12864D |
SPECIFICATIONS FOR LCD MODULE |
ZETTLER Electronics |
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10036876-013CLF |
SAS RECEPTACLE WIDE BASE HYBRID TYPE ASSY |
FCI connector |
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7429FCT521BTLB |
MULTILEVEL PIPELINE REGISTERS |
Integrated Device Technology |
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