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Поиск Datasheets |
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| 507-145E31FB |
EMI/RFI Split Shell Banding Backshell |
Glenair, Inc. |
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507-145E31FB Datasheet
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507-145E31FB и другие |
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| Компонент | Описание | Производитель | PDF |
| AG-240128I |
SPECIFICATIONS FOR LCD MODULE |
ZETTLER Electronics |
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| 1N3605 |
silicon diode |
List of Unclassifed Manufacturers |
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| 0026604170 |
3.96mm (.156") Pitch KK Solid Header, Vertical, Friction Lock, 17 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| A-70567-0343 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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| 0026604110 |
3.96mm (.156") Pitch KK^ Solid Header, Vertical, Friction Lock, 11 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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