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Поиск Datasheets |
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380AB117B14 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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380AB117B14 Datasheet
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380AB117B14 и другие |
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Компонент | Описание | Производитель | PDF |
A-70567-0407 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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0026614050 |
3.96mm (.156") Pitch KK Solid Header, Vertical, Friction Lock, 5 Circuits, Gold (Au) Plating |
Molex Electronics Ltd. |
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A-70567-0356 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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507-145M100HB |
EMI/RFI Split Shell Banding Backshell |
Glenair, Inc. |
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A-70567-0391 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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