 |
Поиск Datasheets |
|
| 507-164C1504EB |
EMI/RFI Split Banding Micro-D Backshell Elliptical Entry |
Glenair, Inc. |
 |
|
507-164C1504EB Datasheet
|
|
|
|
Постоянная ссылка на эту страницу |
|
|
507-164C1504EB и другие |
|
| Компонент | Описание | Производитель | PDF |
| 74300-3163 |
2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide |
Molex Electronics Ltd. |
|
| 380AD105B14 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
|
| 380AD105B10 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
|
| A-70634-0042 |
2.54mm (.100) Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits |
Molex Electronics Ltd. |
|
| 74300-7143 |
2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 72 Circuits, Mounted Height 13.00mm (.512"), Press-Fit Pin Length |
Molex Electronics Ltd. |
|
|  |
|
Datasheet's на KAZUS.RU |
|
|
• 10.000.000 компонентов
• 300.000 поисковых запросов
• 500.000 закачек PDF в месяц
• 700.000 пользователей
|
|
Реклама на сайте |
|
|
|
|
|
|
