|
Поиск Datasheets |
|
507-164C1506EB |
EMI/RFI Split Banding Micro-D Backshell Elliptical Entry |
Glenair, Inc. |
|
|
507-164C1506EB Datasheet
|
|
|
|
Постоянная ссылка на эту страницу |
|
|
507-164C1506EB и другие |
|
Компонент | Описание | Производитель | PDF |
A-70634-0073 |
2.54mm (.100) Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits |
Molex Electronics Ltd. |
|
74301-5107 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Extended PC Tail, Polar/Guide Option, 144 Circuits |
Molex Electronics Ltd. |
|
380AD105M18 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
|
AS3932-BQFT |
3D Low Frequency Wakeup Receiver |
austriamicrosystems AG |
|
1N3880 |
Fast Recovery Diodes(Stud Version) |
Vishay Siliconix |
|
| |
|
Datasheet's на KAZUS.RU |
|
• 10.000.000 компонентов
• 300.000 поисковых запросов
• 500.000 закачек PDF в месяц
• 700.000 пользователей
|
|
Реклама на сайте |
|
|
|
|
|