EMI/RFI Non-Environmental Backshell with Strain Relief

Glenair, Inc.

1.25mm (.049") Pitch FFC/FPC Connector, Through-Hole, Right Angle, ZIF, Top Contact Style, 3 Circuits, Lead-free

Molex Electronics Ltd.

EMI/RFI Non-Environmental Backshell with Strain Relief

Glenair, Inc.

Chip Resistor Arrays

CTS Corporation

IGLOO Low-Power Flash FPGAs with Flash Freeze Technology

Actel Corporation

4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6, 94V-2, Tin (Sn) Over Nickel (Ni) Plating

Molex Electronics Ltd.