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Поиск Datasheets |
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280-013H2P-3 |
O-Ring Panel Sealing Glass-Sealed D-Subminiature High Density Connector |
Glenair, Inc. |
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280-013H2P-3 Datasheet
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280-013H2P-3 и другие |
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Компонент | Описание | Производитель | PDF |
010-89-7722 |
2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail |
Molex Electronics Ltd. |
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DDP-032M2 |
Dual Port Solder Dip |
Yamaichi Electronics Co., Ltd. |
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C410C339Z5R5CA |
Ceramic Leaded Capacitors |
Kemet Corporation |
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AS8E128K32P-200/XT |
128K x 32 EEPROM EEPROM Memory Array |
Austin Semiconductor |
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380LB071NF08 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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