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Поиск Datasheets |
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| BM-20EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate. |
BRIGHT LED ELECTRONICS CORP |
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BM-20EG57ND Datasheet
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BM-20EG57ND и другие |
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| Компонент | Описание | Производитель | PDF |
| 382020 |
Multimodul-Steckverbinder, Raster 2,5 mm |
Lumberg |
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| CTTFR0402TBBV1002 |
Thin Film Precision Chip Resistors |
Central Technologies |
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| 0150200428 |
0.50mm Pitch Premo-Flex FFC Jumper, Opposite Side Contacts (Type D) |
Molex Electronics Ltd. |
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| 50H2D124G |
POLYPHENYLENE SULFIDE FILM CAPACITORS |
RUBYCON CORPORATION |
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| DF153.240DS-0.65V51 |
0.65mm Pitch SMT Board to Board Connector |
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