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75331-0233 |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX^ Backplane Connector System, Power Module, 6 Circuits, 1.27lm (50l) Gold (Au), Lead Free |
Molex Electronics Ltd. |
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75331-0233 Datasheet
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Постоянная ссылка на эту страницу |
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75331-0233 и другие |
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Компонент | Описание | Производитель | PDF |
2N3019DCSM |
DUAL HIGH FREQUENCY NPN TRANSISTORS IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS |
Seme LAB |
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75331-0335 |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX^ Backplane Connector System, Power Module, 6 Circuits, 1.27lm (50l) Gold (Au), Lead Free |
Molex Electronics Ltd. |
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CY62136VLL-70ZI |
128K x 16 Static RAM |
Cypress Semiconductor |
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75331-0447 |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX^ Backplane Connector System, Power Module, 6 Circuits,1.27lm (50l) Gold (Au) |
Molex Electronics Ltd. |
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120-144-20STN |
Annular Convoluted Tubing |
Glenair, Inc. |
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