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CY7C1370CV25-250BZC |
512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
Cypress Semiconductor |
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CY7C1370CV25-250BZC Datasheet
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CY7C1370CV25-250BZC и другие |
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Компонент | Описание | Производитель | PDF |
0737800243 |
2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 3.00mm (.118"), |
Molex Electronics Ltd. |
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5962-8670401VXA |
Current Mode PWM Controller |
Texas Instruments |
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0736590002 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76lm (30l |
Molex Electronics Ltd. |
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2QSP20-TF3-221331LF |
Thin Film on Silicon 2QSP / 2NBS-XX3 Dual Terminator |
Bourns Electronic Solutions |
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12301 |
Fuse carriers, Domestic cartridge fuses |
List of Unclassifed Manufacturers |
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