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Поиск Datasheets |
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| 0739445000 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits |
Molex Electronics Ltd. |
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0739445000 Datasheet
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Постоянная ссылка на эту страницу |
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0739445000 и другие |
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| Компонент | Описание | Производитель | PDF |
| CY7C1372C-167AI |
512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
Cypress Semiconductor |
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| 0739432200 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, Solder Tail, Closed End, 72 Circuits |
Molex Electronics Ltd. |
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| 0739446001 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits |
Molex Electronics Ltd. |
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| 0739445003 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits |
Molex Electronics Ltd. |
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| 2RS2T8SG |
2.00mm RECEPTACLE STRIPS .079 [2.00] CENTERLINE |
Adam Technologies, Inc. |
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