TERMINAL BLOCK HEADER ASSEMBLY 180 Љ OPEN ENDS, STACKING 5mm PITCH

Tyco Electronics

Low Power Dual Operational Amplifiers

National Semiconductor

2.00mm (.079") Pitch VHDM^ Board-to-Board Backplane Header, Vertical, 6-Row,Open Signal Module, 150 Circuits, 25 Columns, Pin Length 5.15mm (.203"), 0.76lm

Molex Electronics Ltd.

32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (512 K x 8-Bit/256 K x 16-Bit) Static RAM

Advanced Micro Devices

18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL Architecture

Cypress Semiconductor

2.00mm (.079") Pitch VHDM^ Board-to-Board Daughtercard Receptacle, Right Angle,6-Row, 2 Blade Power Module, 1 Circuit

Molex Electronics Ltd.