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| CY7C1372DV25-167BZXI |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL Architecture |
Cypress Semiconductor |
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CY7C1372DV25-167BZXI Datasheet
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CY7C1372DV25-167BZXI и другие |
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| Компонент | Описание | Производитель | PDF |
| 2SA1012G-x-TN3-T |
HIGH CURRENT SWITCHING APPLICATION |
Unisonic Technologies |
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| 2-282836-7 |
TERMINAL BLOCK, PCB MOUNT SIDE WIRE ENTRY, STACKING WITH INTERLOCK, 5.00mm PITCH |
Tyco Electronics |
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| 5962-8859101SA |
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
Texas Instruments |
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| 0740592503 |
2.00mm (.079") Pitch VHDM^ Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin |
Molex Electronics Ltd. |
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| 2SA1012G-x-TA3-T |
HIGH CURRENT SWITCHING APPLICATION |
Unisonic Technologies |
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