18-Mb (512K x 36/1M x 18) Pipelined SRAM

Cypress Semiconductor

Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

SPANSION

Audio Frequency Amplifier Applications

Toshiba Semiconductor

DUAL 200mW SURFACE MOUNT ZENER DIODE

Diodes Incorporated

Hermetically Sealed Low IF, Wide VCC, Logic Gate Optocouplers

AVAGO TECHNOLOGIES LIMITED

2.54mm (.100") Pitch C-Grid^ Receptacle, Right Angle, Through Hole, Dual RowShrouded with Pegs, Version A, High-Temperature, 26 Circuits, 0.4lm (15l") Gold (Au)

Molex Electronics Ltd.