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| 2SA1360_10 |
Audio Frequency Amplifier Applications |
Toshiba Semiconductor |
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2SA1360_10 Datasheet
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Постоянная ссылка на эту страницу |
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2SA1360_10 и другие |
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| Компонент | Описание | Производитель | PDF |
| 0754334103 |
1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX Backplane Connector System, Right Guide Header |
Molex Electronics Ltd. |
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| CY7C1387CV25-200BZI |
18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM |
Cypress Semiconductor |
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| 2SA1361 |
2SA1361 |
List of Unclassifed Manufacturers |
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| 5962-9175301MRA |
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
Texas Instruments |
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| 0754334104 |
1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX^ Backplane Connector SystemRight Guide Header, 60 Circuits, Gold (Au) 0.76lm (30l"), Pin Length 4.55mm (.179") |
Molex Electronics Ltd. |
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