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| 0877583017 |
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 30 Circuits, 0.76lm (30l) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
Molex Electronics Ltd. |
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0877583017 Datasheet
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0877583017 и другие |
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| Компонент | Описание | Производитель | PDF |
| 0877582817 |
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 28 Circuits, 0.76lm (30l) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
Molex Electronics Ltd. |
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NPN Plastic-Encapsulate Transistor |
Weitron Technology |
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| BFY75 |
Bipolar NPN Device |
Seme LAB |
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| 14-60-0187 |
2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 3.81lm (150l") Tin/Lead (SnPb) |
Molex Electronics Ltd. |
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| CD16FD752J03 |
Snubber and RF Application, Mica Capacitors Higher dV/dt Capability and Flatter Insertion Loss |
Cornell Dubilier Electronics |
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