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C0603C508C3GAC Datasheet
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C0603C508C3GAC и другие |
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Компонент | Описание | Производитель | PDF |
D3460-0000SC |
designed for IDC (Insulation Displacement Connector) connection with 1.27mm pitch flat cable |
List of Unclassifed Manufacturers |
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15911064 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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C0603C508B3RAC |
CERAMIC CHIP CAPACITORS |
Kemet Corporation |
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BZY97C10 |
POWER DISSIPATION: 1.5 W |
Shenzhen Luguang Electronic Technology Co., Ltd |
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4311T-106-2222DD |
Thin Film Molded SIP |
Bourns Electronic Solutions |
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Datasheet's на KAZUS.RU |
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