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| 30968-1167 |
2.54mm (.100") Pitch, 0.64mm (.025") Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray |
Molex Electronics Ltd. |
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30968-1167 Datasheet
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30968-1167 и другие |
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| Компонент | Описание | Производитель | PDF |
| 2254782597 |
Surface-mount ceramic multilayer capacitors |
NXP Semiconductors |
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| 15911648 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| EMS22Q53-B28-MD3 |
Non-Contacting Incremental Encoder |
Bourns Electronic Solutions |
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| A62RA-125 |
8 Pin DIP Tri-State ACMOS Clock Oscillators |
Connor-Winfield Corporation |
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| CD74HC241MG4 |
High-Speed CMOS Logic Octal Buffer/Line Drivers, Three-State |
Texas Instruments |
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