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44067-0403 |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76lm (30l") Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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44067-0403 Datasheet
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44067-0403 и другие |
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Компонент | Описание | Производитель | PDF |
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High Current Glass Passivated Molding Single-Phase Bridge Rectifier |
Leshan Radio Company |
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30KPA102A-B |
Transient Voltage Suppression Diodes |
Littelfuse |
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BL-M23C581SG |
LED DOT MATRIX |
BetLux Electronics |
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78119-1288 |
0.50mm (.020) Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Gold Plating, 28 Circuits, Lead Free |
Molex Electronics Ltd. |
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44051 |
PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins |
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