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| 447FS711XW10 |
Composite EMI/RFI Banding Backshell with Strain Relief |
Glenair, Inc. |
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447FS711XW10 Datasheet
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447FS711XW10 и другие |
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| Компонент | Описание | Производитель | PDF |
| 802-10-064-61-001000 |
INTERCONNECTS .100 Grid (.030 dia.) Pins, Solderless Press-Fit Double Row |
Mill-Max Mfg. Corp. |
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| 170124250FC |
High Current / Low ESR, Wrap and Fill Axial Leaded Capacitors |
List of Unclassifed Manufacturers |
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| COP8SGE644N3 |
8-Bit CMOS ROM Based and OTP Microcontrollers with 8k to 32k Memory, Two Comparators and USART |
National Semiconductor |
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| 240128-06-GR-R-ST-ELP-GY |
240 x 128 Dot Graphic LCD Assembly With T6963C Toshiba Graphic LCD Controller EL Panel & LED Backlight Assembly |
List of Unclassifed Manufacturers |
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| DBCIDCB11S20AG1 |
FEMALE HEADERS FEMALE HEADER RIGHT ANGLE - 8.6mm PROFILE |
Dubilier |
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