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Поиск Datasheets |
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447FW325XW16 |
Composite Standard Profile EMI/RFI Banding Backshell with Shrink Boot Porch |
Glenair, Inc. |
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447FW325XW16 Datasheet
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447FW325XW16 и другие |
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Компонент | Описание | Производитель | PDF |
170152J630BB1 |
Type 170 Axial Leaded Metallized Polypropylene |
Cornell Dubilier Electronics |
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C1210C103K2RAC |
CERAMIC CHIP/STANDARD |
Kemet Corporation |
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EP2C5A20T324I8N |
Cyclone II Device Family |
Altera Corporation |
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802-90-064-61-001000 |
INTERCONNECTS .100 Grid (.030 dia.) Pins, Solderless Press-Fit Double Row |
Mill-Max Mfg. Corp. |
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COP8SGE740D7 |
8-Bit CMOS ROM Based and OTP Microcontrollers with 8k to 32k Memory, Two Comparators and USART |
National Semiconductor |
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