High Density D-Subminiature Connector

DDK Ltd.

CERAMIC CHIP / HIGH VOLTAGE

Kemet Corporation

2K I2C Serial EEPROM

Microchip Technology

Capacitors for Power Factor Correction PhiCap Metallized Polypropylene Film Capacitor 3-Phase

EPCOS

SMD ESD Protection Diode

Comchip Technology

1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Header, Right Angle,10 Power Contacts, 36 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125") Thick PC Board

Molex Electronics Ltd.