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70287-1136 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 144 Circuits |
Molex Electronics Ltd. |
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70287-1136 Datasheet
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70287-1136 и другие |
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Компонент | Описание | Производитель | PDF |
L810HW-R68MF-98 |
HIGH CURRENT MOLDED POWER INDUCTORS |
Superworld Electronics |
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MC1GU256HBVA-0QC00 |
MultiMediaCard Specification |
Samsung semiconductor |
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MC1GU256HCFB-0QC00 |
MultiMediaCard Specification |
Samsung semiconductor |
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MIM-3337S5F |
INFRARED RECEIVER MODULE |
Unity Opto Technology |
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MA73TCA |
14 pin DIP, 5.0 Volt, ACMOS/TTL, Clock Oscillator |
MTRONPTI |
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