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ECKT-20-30.000M-LA Datasheet
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ECKT-20-30.000M-LA и другие |
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Компонент | Описание | Производитель | PDF |
MC22FF182F |
High-Frequency, High-Stability Chip for Instruments and RF |
List of Unclassifed Manufacturers |
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AE10390 |
PCB JACK, 6P4C |
Assmann Electronics Inc. |
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70400-0259 |
2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 26, 3.81lm (150l") Tin/Lead (SnPb) |
Molex Electronics Ltd. |
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M38005M6-XXXSP |
8-BIT SINGLE-CHIP MICROCOMPUTER 740 FAMILY / 38000 SERIES |
Renesas Technology Corp |
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70400-0251 |
2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 26, 3.81lm (150l") Tin/Lead (SnPb), 7 Circuits |
Molex Electronics Ltd. |
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