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| 44067-0401 DATASHEET | |
Компонент | Описание | Производитель | PDF | Buy |
44067-0401 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
| *44067-0*: Расширенные результаты | |
Компонент | Описание | Производитель | PDF | Buy |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm | Molex Electronics Ltd. | | |
SD-44067-001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick | Molex Electronics Ltd. | | |
44067-0401 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
44067-0402 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
44067-0403 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76lm (30l") Gold (Au) Selective Plating | Molex Electronics Ltd. | | |
44067-0601 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
44067-0602 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm | Molex Electronics Ltd. | | |
44067-0603 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
44067-0801 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
44067-0802 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick | Molex Electronics Ltd. | | |
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