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| A-70567-0257 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
A-70567-0257 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. |  |  |
| *A-70567-02*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| A-70567-0201 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0202 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0203 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0204 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0205 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0206 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0207 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0207 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0208 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0209 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0209 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0210 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0211 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0211 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0212 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0212 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0213 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0214 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70567-0215 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits | Molex Electronics Ltd. | | |
| A-70567-0215 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
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